Bücher für Medizin, Wissenschaft und Studium

A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

1. Introduction, 2. Contamination and Silicon Device Characteristics, 3. Mechanism of Particle Adhesion onto Silicon Wafer, 4. Technology for Analyzing and Evaluating Silicon Wafer Surfaces (Fundamentals of Analysis and Evaluation Technology), 5. Making Silicon Wafer Processes Cleaner, 6. Silicon Wafer Cleaning Technologies